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AssigneeTomoegawa Paper Co., Ltd.
InventorsHitoshi Narushima, Yoshikazu Tsukamoto, Tadahiro Oishi, Atsushi Koshimura
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This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.
An adhesive tape for tape automated bonding (TAB), comprising a protective film and an adhesive layer laminated on an organic-insulating film, wherein said adhesive layer comprises a resol-type phenol resin and a polyamide resin, and further wherein said resol-type phenol resin is from 2 to 35% by weight of said adhesive layer.
Dependencies are inferred from the claim text.