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AssigneeTokin Corporation
InventorsHiroshi Momotani, Tsutomu Otsuka
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An organic solvent electrolyte is provided for electrolytically forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet. The organic solvent electrolyte comprises a metallic salt including at least one metalic element with a supporting electrolyte, the balance being an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet, wherein R denotes a rare earth element including Y and T denotes a transition metal including R, Fe and B as main components. The supporting electrolyte includes at least one selected from a group consisting of: (1) a boric acid compound including at least one of R'.sub.3 BO.sub.3 methyl, ethyl, propyl, butyl group, MBO.sub.2 (in which M denotes H or Na, K, Li metal), M'BO.sub.3 (M' denotes B or Na, K, Li metal), M'"BO.sub.x O.sub.(3x+2)/2 (X is an even number of more than 2). (2) a C10.sub.4 salt of an alkali metal or tetraalkylammonium including at least one of M'C10.sub.4 or R'.sub.4 NC10.sub.4, and (3) a BF.sub.4 salt of an alkali metal or tetraalkylammonium including at least one of M'BF.sub.4 or R'NBF.sub.4.
An organic solvent electrolyte for forming a plating film on the surface of a R.sub.2 R.sub.14 B intermetallic compound permanent magnet which is used in a plating process based on a plating method using organic solvent electrolyte comprising a metallic salt including at least one metallic element, a supporting electrolyte and the balance of an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet (herein, R denotes a rare earth element including Y and T denotes a transition metal) including R, Fe and B as main components, characterized in that said supporting electrolyte includes at least one selected from a group consisting of:
An organic solvent electrolyte for plating which is used in a plating process based on a plating method using organic solvent electrolyte comprising a metallic salt including at least one metallic element, a supporting electrolyte and the balance of an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet (herein, R denotes a rare earth element including Y and T denotes a transition metal) including R, Fe and B as main components, and is characterized in that said supporting electrolyte includes at least one of a trifluoroacetate, an acetic acid and a perchlorate as the metallic salt and at least one element of Al, Pb, Sn, Cr, Ni, Cu and Zn as the acids.
An organic solvent electrolyte for plating which is used in a plating process based on a plating method using organic solvent electrolyte comprising a metallic salt including at least one metallic element, a supporting electrolyte and the balance of an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet (herein, R denotes a rare earth element including Y and T denotes a transition metal) including R, Fe and B as a main components, and is characterized in that said organic solvent includes at least one of a protic ampthoteric solvent and a protophilic solvent.
An organic solvent electrolyte for plating a R.sub.2 T.sub.14 B intermetallic compound permanent magnet as claimed in either one of claims 1-8 and 10-29, characterized in that either one of said organic solvent electrolyte includes water of substantially less than 3000 ppm.
Dependencies are inferred from the claim text.