Electrochemical interconnection
AssigneeHughes Aircraft Company
InventorsCarlyle L. Helber, Jr., Frank A. Ludwig
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Abstract
Processes for fabricating electrochemical interconnections between semiconductor chip pads and substrate pads. First, pads on a substrate are electrically shorted by depositing a film of conductive metal, conductive bumps are created on the substrate pads, and the pads on the substrate are aligned with pads on a semiconductor chip. Then, by electrochemically depositing metal to the bumps, electrical interconnections are formed between the semiconductor chips pads and the substrate pads. Finally, the film of conductive metal is removed to eliminate the electrical shorting. The resulting electrochemical interconnections are highly reliable and have high tensile strengths.
Claims14
A process for interconnecting pads on semiconductor chips with pads on a substrate, said process comprising the steps of:
- electrically shorting said pads on said substrate by providing a shorting layer;
- creating conductive bumps on said shorting layer above said pad on said substrate;
- aligning said pads on said substrate with said pads on said semiconductor chips;
- and
- depositing metal to said bumps to form an electrical interconnection between said pads on said semiconductor chip and said pads on said substrate.
A process for improving the reliability of the interconnection between soldered chip pads and substrate pads, said process comprising the steps of:
- providing a soldered interconnection, said interconnection connecting said chip pads to said substrate pads;
- and
- depositing metal to said interconnection, including the steps of:
- making said interconnection cathodic;
- providing an external anode in contact with an electroplating solution;
- and
- pumping said electroplating solution to said interconnection wherein metal is electroplated on said interconnection.
Dependencies are inferred from the claim text.