Surface treating cleaning method
AssigneesWako Pure Chemical Industries, Ltd., Purex Corporation
InventorsIchiro Hayashida, Masahiko Kakizawa, Kenichi Umekita, Hiroyoshi Nawa, Hisashi Muraoka
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Abstract
A combination of a first surface treating solution comprising an inorganic or organic alkali such as ammonia or a quaternary ammonium hydroxide, hydrogen peroxide, water and a second surface treating solution of ultra-pure water, at least one of the first and second surface treating solutions containing as a complexing agent a compound having one or more phosphonic acid groups in the molecule and showing chelating ability, or an oxidized form thereof, or polyphosphoric acid or a salt thereof, is effective for making semiconductor surfaces free from harmful metallic impurities such as Fe, Al, Zn, etc.
Claims8
A process for treating semiconductor surfaces, which comprises a step of treating surfaces of semiconductors contaminated with metallic impurities including at least one of Fe, Al, Zn, Ca and Mg with a surface treating solution comprising an inorganic or organic alkali, hydrogen peroxide and water as major components, and a step of treating the resulting surface with ultra-pure water, at least one of the surface treating solution and the ultra-pure water containing as a complexing agent a compound having one or more phosphonic acid groups or a salt thereof and showing chelating ability or an oxidized form thereof, or a polyphosphoric acid or a salt thereof.
Dependencies are inferred from the claim text.