Coatings for microelectronic devices and substrates
AssigneeDow Corning Corporation
InventorLoren A. Haluska
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Abstract
The present invention relates to a method of forming a ceramic or ceramic-like coating on a substrate, especially electronic devices, as well as the substrate coated thereby. The method comprises coating said substrate with a solution comprising a solvent, hydrogen silsesquioxane resin and a modifying ceramic oxide precursor selected from the group consisting of tantalum oxide precursors, niobium oxide precursors, vanadium oxide precursors, phosphorous oxide precursors and boron oxide precursors. The solvent is then evaporated to thereby deposit a preceramic coating on the substrate. The preceramic coating is then ceramified by heating the to a temperature of between about 40.degree. C. and about 1000.degree. C. This coating, moreover, may be covered by additional passivation and barrier coatings.
Claims3
A homogenous liquid composition comprising a solvent, hydrogen silsesquioxane resin and a modifying ceramic oxide precursor selected from the group consisting of tantalum oxide precursors, niobium oxide precursors, vanadium oxide precursors, phosphorous oxide precursors and boron oxide precursors, wherein said solution contains between about 0.1 and about 35 weight percent solids of hydrogen silsesquioxane and modifying ceramic oxide precursor and said modifying ceramic oxide precursor is present in an amount such that upon heating to a temperature in the range of between about 40.degree. and about 1000.degree. C., the final ceramic coating contains between about 0.1 and about 30 weight percent modifying ceramic oxide.
Dependencies are inferred from the claim text.