Fluxless soldering process
AssigneeNippondenso Co., Ltd.
InventorsTakao Yoneyama, Katsuhiro Izuchi
Life of this patent
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Abstract
A fluxless soldering process comprising the steps of: preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability; placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil and with the bonding surface thereof facing downward, to form an assembly; heating the assembly in a reducing atmosphere to fuse the solder foil, thereby forming a molten solder between the first and second members; and cooling the assembly to solidify the molten solder, thereby bonding the first and second members.
Claims9
A fluxless soldering process comprising the steps of:
- preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability and having a cross-sectional area smaller than that of the bonding surface of the first member;
- placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil with the bonding surface thereof facing downward, to form an assembly;
- heating the assembly in a reducing atmosphere to fuse the solder foil, thereby bonding the first and second members.
Dependencies are inferred from the claim text.