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US 5,289,661 AGranted
Notch beveling on semiconductor wafer edges
AssigneeTexas Instruments Incorporated
InventorsJoel B. Jones, Lawrence D. Dyer
Life of this patent
Estimating the term…
Abstract
An apparatus and method of contouring the edge of a semiconductor wafer in a fiduciary mark notch utilizes a contouring wheel or burr having a smaller diameter than the diameter of the fiduciary mark notch.
Claims14
An apparatus for polishing the edge and the fiduciary mark notch edge on each face of a semiconductor wafer, comprising:
- a first polishing wheel for grinding the edge of semiconductor wafer;
- a second smaller polishing wheel for polishing simultaneously each face of the edge of the wafer in the fiduciary mark notch;
- and
- means for rotating the semiconductor wafer, said first wheel and said polishing wheel during edge and notch polishing.
1 more element
An apparatus for polishing the edge and fiduciary mark notch edge on each face of a semiconductor wafer, comprising:
- a first polishing wheel for polishing the edge of the semiconductor wafer;
- a second polishing wheel for polishing simultaneously each face of the edge of the wafer in the fiduciary mark notch;
- and
- means for rotating said semiconductor wafer, said first polishing wheel and said second polishing wheel during polishing;
- and
- means for moving the second polishing wheel into and out of the fiduciary mark notch during polishing.
3 more elements
A method for polishing the edge of a semiconductor wafer and including both sides of the edge of the wafer in a fiduciary mark notch, comprising the steps of:
- polishing the edge of the semiconductor wafer with a first polishing wheel;
- polishing simultaneously both sides of the edge of the semiconductor wafer in the fiduciary notch with a second polishing wheel;
- and
- rotating the semiconductor wafer, first polishing wheel and second polishing wheel during polishing of the wafer edge and the notch edge.
1 more element
Dependencies are inferred from the claim text.