Applying conductive lines to integrated circuits
AssigneeInternational Business Machines Corporation
InventorsPedro A. Chalco, Matthew F. Cali, Laertis Economikos, James L. Speidell
Life of this patent
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Abstract
A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
Claims27
A method of applying a conductive line to a substrate, comprising the steps of:
- aligning a conductive line in juxtaposition with a selected area of a substrate, said conductive line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said conductive line being suspended by said sidewalls of said carrier opening;
- bonding said conductive line to said selected area of said substrate;
- and
- detaching said conductive line from said carrier.
A method of repairing an open circuit defect, comprising the steps of:
- aligning a repair line in juxtaposition with an open circuit defect of a circuit line, said repair line being suspended in a carrier having a carrier opening therethrough, said carrier opening being defined by sidewalls, and said repair line being suspended by the sidewalls of said carrier opening;
- bonding said repair line to said circuit line over said open circuit defect;
- and
- detaching said repair line from said carrier.
Dependencies are inferred from the claim text.