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US 5,289,342 AGranted
System with cooling of electronic components on a circuit board
AssigneeErgo Computing, Inc.
InventorsTom J. Spalding, Keith E. Kowal, James H. Bleck, Scott H. Wakefield, John E. Thrailkill
Life of this patent
Estimating the term…
Abstract
The system includes a circuit board on which electrical components are mounted. The components are mounted on the front side of the board, and the back side of the board is thermally coupled to the housing by a liquid-filled thermal heat sink pouch between the board and the housing. A heat generating component such as a microprocessor is mounted to the front side of the board, but the top surface of the component is directed toward the back side of the board such that it is also thermally coupled to the housing.
Claims4
An electronic system comprising:
- a housing;
- a circuit board within the housing having a front side with electronic components mounted thereon and a rearward back side contacting a heat sink such that the back side is thermally coupled to the housing by the heat sink;
- a mounting board mounted on the front side of the circuit board;
- and
- a heat generating electronic component having a mounting side and a top side, the heat generating component being mounted on the mounting board and facing rearwardly where the top side of the heat generating component contacts the heat sink such that the heat generating component is thermally coupled to the housing by the heat sink.
2 more elements
Dependencies are inferred from the claim text.