Testing of integrated circuit devices on loaded printed circuit

A translator module for testing electrical continuity between spaced apart electrical leads on an external printed circuit board and an array of fixed conductive pins in an external circuit device adapted to move in and out of contact with the translator module, the translator module comprising:

• a rigid housing adapted for mounting over the external circuit board, the housing having an upper side and a lower side;
• first and second rows of spaced apart electrical contacts arranged on the lower side of the module housing for releasable contact with corresponding leads on the external circuit board;
• a plurality of generally planar electrically conductive test pads disposed in a substantially common plane on the upper side of the housing for making electrical contact with individual pins of said external circuit device, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the housing, each test pad having a size greater than the side of the pins adapted to contact the test pads;
• and
• a printed circuit board mounted in a fixed position on the housing and having an array of electrical circuits thereon for internally electrically connecting said first and second rows of contacts on the module to corresponding test pads on the module so that contact between the individual leads on the external circuit board and corresponding contacts on the module is translated electrically via the test pads to individual pins in the external circuit device, in which the in-line spacing between the test pads on the upper side of the housing is greater than the in-line spacing between the contacts on the lower side of the housing.

A translator module for making contact with first and second rows of spaced apart leads on a printed circuit board, to facilitate circuit verification between the leads on the board and conductive pins on an external circuit device adapted for contact with the translator module, the translator module comprising:

• a rigid housing having top and bottom sides, the housing being adapted for mounting over the circuit board;
• first and second rows of spaced apart electrical contacts arranged on the bottom side of the module housing for releasable contact with corresponding leads when the module is mounted over the board;
• a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual pins in said circuit device, in which the module contacts each comprise a spring supported from above on the module housing and arranged to be held under spring tension when the module is pushed down into contact with one off said leads on the board;
• and
• means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module so that contact between the individual leads on the board and corresponding contacts on the module is translated electrically, via the test pads, to individual test pins on said circuit device.

A translator module for making contact with first and second rows of spaced apart leads on a printed circuit board, to facilitate circuit verification between the leads on the board and an array of conductive pins on an external circuit device adapted to contact the module, the translator module comprising:

• a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the board, the top side of the housing having a fixed upper surface;
• first and second rows of spaced apart spring-biased electrical contacts affixed to the bottom side of the module housing, the contacts each being formed as individual spring members which are independently compliant and movable relative to the housing for releasable contact under spring tension independently with corresponding leads on the board when the module is mounted over the board;
• a plurality of electrically conductive test pads on the upper surface of the housing and disposed thereon in fixed positions with respect to each other and with respect to the contacts on the housing, the test pads lying in a substantially common plane on the fixed upper surface of the module housing and arranged thereon for contact with individual pins in said circuit device;
• and
• means for internally electrically connecting said first and second rows of module contacts to corresponding test pads on the housing so that contact between the individual leads on the board and corresponding contacts on the housing is translated electrically, via the test pads, to individual pins in said external circuit device.

A translator module for making contact with first and second rows of spaced apart leads on a printed circuit board, to facilitate circuit verification between the leads and an array of conductive pins in an external circuit device, the translator module comprising:

• a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the board, the top side of the housing having a fixed upper surface extending across a surface area having a length and a width;
• first and second rows of spaced apart spring-biased electrical contacts affixed to the bottom side of the module housing, the contacts each being formed as individual spring members which are independently compliant and movable relative to the housing for releasable contact under spring tension independently with corresponding leads on the board when the module is mounted over the board;
• a plurality of electrically conductive test pads on the fixed upper surface of the housing, the pads being disposed thereon in fixed positions with respect to each other in a two-dimensional array in which the test pads are spaced apart across the length and width of said fixed upper surface;
• and
• means for internally electrically connecting the first and second rows of contacts to corresponding test pads so that contact between the individual leads and corresponding contacts on the housing is translated electrically, via the test pads, to corresponding individual pins in said external circuit device.