Tape automated bonding(tab)semiconductor device and method for making the same

A tape automated bonding (TAB) semiconductor device comprising:

• an electronic component having bonding pads arranged on a face thereof;
• and
• a TAB tape coupled to the electronic component, the TAB tape comprising a patterned metal layer overlying a polymer support and an opening in the polymer support for receiving the electronic component, wherein the patterned metal layer comprises:
• a first lead pattern having a predetermined pitch including individual leads with inner lead portions extending into the opening in the polymer support and connected to the bonding pads on the electronic component and with outer lead portions extending away from the opening for connection to external circuitry, wherein diagonally opposing sections of the polymer support which are adjacent to the electronic component are void of the first lead pattern;
• and
• a second lead pattern having the predetermined lead pitch and occupying the diagonally opposing sections of the polymer support, without extending into the opening thereof, such that a distribution of stresses in the polymer support surrounding the electronic component are substantially uniform.

A tape automated bonding (TAB) semiconductor device comprising:

• a semiconductor die having a plurality of bond pads on a surface thereof;
• and
• a TAB tape coupled to the semiconductor die, the TAB tape comprising:
• a polymer support layer having a die receiving opening formed therein, the opening having four sides and four corners;
• a plurality of electrical leads formed on the polymer support layer and having a predetermined spatial density, each electrical lead having an inner lead portion which protrudes into the opening from one of the four sides and is connected to one of the plurality of bond pads of the semiconductor die;
• and
• a plurality of mechanical stabilizing leads formed on the polymer support layer, without extending into the opening, and adjacent each of the four corners of the opening, wherein the plurality of mechanical stabilizing leads also has the predetermined spatial density.