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US 5,288,999 AGranted
Manufacturing method including near-field optical microscopic examination of a semiconductor wafer
AssigneeAT&T Bell Laboratories
InventorsRobert E. Betzig, Ernst M. Gyorgy, Jay K. Trautman, Raymond Wolfe
Life of this patent
Estimating the term…
Abstract
An optical system useful, e.g., for near-field scanning optical microscopy is provided. The system incorporates a probe having improved properties. In one embodiment, the probe comprises a tapered and partially metallized portion of a single-mode optical fiber.
Claims2
A method for manufacturing an article, comprising the steps of:
- a) providing a multiplicity of semiconductor wafers, each wafer having a surface to be patterned;
- b) setting at least one process parameter;
- c) processing at least a first wafer according to the process parameter such that a pattern is formed on the surface of the wafer, the pattern having a characteristic dimension;
- d) measuring the characteristic dimension in at least the first wafer;
- e) comparing the characteristic dimension to a predetermined range of values;
- f) if the characteristic dimension lies outside of the predetermined range of values, changing the process parameter to bring the characteristic dimension within the predetermined range of values;
- g) after (f), processing at least a second wafer according to the process parameter;
- and
- h) performing, on at least the second wafer, at least one additional step toward completion of the article;
- wherein the measuring step comprises:
- i) impinging incident light having at least one incident wavelength on the wafer surface such that at least a portion of the incident light is reflected from the wafer surface;
- j) admitting a portion of the reflected light into a waveguiding body through an aperture that is distant from the wafer surface by no more than the incident wavelength, and that is smaller, in at least one lateral dimension, than the incident wavelength;
- b) exciting a guided metallic mode of electromagnetic radiation within the waveguiding body;
- c) adiabatically converting a portion of the reflected light from the metallic mode to at least one guided dielectric mode;
- and
- d) detecting the adiabatically converted light.
13 more elements
A method for manufacturing an article, comprising the steps of:
- a) providing a multiplicity of semiconductor wafers, each wafer having a surface to be patterned;
- b) setting at least one process parameter;
- c) processing at least a first wafer according to the process parameter such that a pattern is formed on the surface of the wafer, the pattern having a characteristic dimension;
- d) measuring the characteristic dimension in at least the first wafer;
- e) comparing the characteristic dimension to a predetermined range of values;
- f) if the characteristic dimension lies outside of the predetermined range of values, changing the process parameter to bring the characteristic dimension within the predetermined range of values;
- g) after (f), processing at least a second wafer according to the process parameter;
- and
- h) performing, on at least the second wafer, at least one additional step toward completion of the article;
- wherein the measuring step comprises:
- i) admitting incident light having at least one incident wavelength into an optical waveguiding body such that a guided dielectric mode is excited within the waveguiding body;
- j) adiabatically converting a portion of the incident light from the guided dielectric mode to a guided metallic mode;
- and
- k) emitting a portion of the adiabatically converted light from an aperture that is distant from the wafer surface by no more than the incident wavelength, and that is smaller, in at least one lateral dimension, than the incident wavelength, the emitting step carried out such that at least a portion of the emitted light is reflected from the wafer surface;
- and
- l) detecting at least a portion of the light reflected from the wafer surface.
13 more elements
Dependencies are inferred from the claim text.