Cyanoacrylate adhesives with improved cured thermal properties utilizing substituted aromatic additive

Abstract

A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a mono, poly or hetero aromatic compound characterized by at least three substitutions on an aromatic ring thereof, two or more of said substitutions being electron withdrawing groups selected from the group consisting of NO.sub.2, CN, CF.sub.3, NR.sup.1.sub.3.sup.+, SR.sup.1.sub.2.sup.+, C(.dbd.O)R.sup.1, C(.dbd.O)OR.sup.1, NO, CCl.sub.3, SO.sub.2, S(.dbd.O), SO.sub.3, SO.sub.2 R.sup.1, SO.sub.2 OR.sup.1 and F, one or more of said substitutions being leaving groups selected from the group consisting of F, Br, Cl, I, NO.sub.2, CN, SOR.sup.1, SO.sub.2 R.sup.1 and SO.sub.2 OR.sup.1, and R.sup.1 is an optionally substituted hydrocarbon group. Example such compounds have the formula: ##STR1## where L is the leaving group and the W groups are the electron withdrawing groups.

Dependencies are inferred from the claim text.