US 5,288,667 AGranted

Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorsMasaaki Taruya, Mitsuru Koiwa

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Abstract

In a method of manufacturing a semiconductor package with an externally connecting coupler, a semiconductor package has a die pad portion on which a semiconductor device is mounted and a plurality of leads including at least one lead extending from the die pad portion and coupled to each other by a tie bar. The method includes the steps of mounting the device on the die pad of the leadframe, wire bonding between the device and inner leads, premolding the inner leads so as to ensure mutual mechanical connection of the leads and support of the leads during manufacture, cutting off unnecessary portions of the leadframe and portions of the leadframe located between the leads to electrically separate the leads from each other, and forming a mold package and the external connecting coupler as one unit using an electrically insulating resin. The mold package seals the die pad portion of the leadframe on which the device is mounted, the inner leads and the premolding. The externally connecting coupler covers the outer leads so as to achieve mechanical coupling to an external device and hence electrical connection of the outer leads. A method in which an externally connecting coupler is coupled to the leadframe before cutting off the tie bar so as to ensure mutual mechanical connection of the leads of the leadframe and support of the leads during the manufacture is also included.

Claims6

Dependent claims

A method of manufacturing a semiconductor package with an externally connecting coupler, said semiconductor package being a mold packaged leadframe having a die pad portion on which at least one semiconductor device forming an internal circuit is mounted and a plurality of leads including at least one lead extending from said die pad portion, said plurality of leads being coupled to each other by a tie bar, said method comprising the steps:

die mounting said semiconductor device on said die pad portion of said leadframe;
conducting wire bonding between said semiconductor device and inner leads of said leads;
forming the externally connecting coupler which provides mechanical connection to an external device, said coupler having a plurality of terminals, each terminal having an inner end to be connected to said lead and an outer end which is connectable to the external device;
electrically connecting the inner end of each of said terminals of said coupler to the corresponding lead in the plurality of leads of said leadframe to couple said coupler to said leadframe;
cutting off unnecessary portions of said leadframe and portions of said leadframe located between said leads so as to electrically separate said leads;
and
forming a mold package for packaging said die pad portion of said leadframe on which said semiconductor device is mounted, said plurality of leads of said leadframe and at least part of said coupler containing said plurality of terminals.

4 more elements

Dependencies are inferred from the claim text.