Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
AssigneeInternational Business Machines Corporation
InventorsMichael J. Cibulsky, Konstantinos I. Papathomas, William J. Summa, David W. Wang, Patrick R. Zippetelli
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Abstract
A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
Claims25
A composite for providing a rigid-flexible circuit board construction comprising at least one core wherein said at least one core comprises both a dielectric substrate and at least one conductive layer located on said dielectric substrate;
- at least one sub-composite located on top of said at least one conductive layer and which comprises a polyimide layer and a rigid dielectric substrate, and wherein said rigid dielectric substrate contacts said at least one conductive layer;
- a release layer located on top of said at least one sub-composite in a predetermined location to correspond to the desired flexible segment of said circuit board;
- at least one rigid bonding layer located next to each of the two sides of said release layer to correspond to the desired rigid portion of said circuit board;
- and at least one second conductive layer located on top of said at least one bonding layer and said at least one release layer.
A rigid-flexible circuit board construction comprising:
- (a) at least one core, wherein said at least one core comprises both a dielectric substrate and at least one conductive layer located on said dielectric substrate;
- (b) at least one sub-composite located on top of said at least one conductive layer and in both the rigid and flexible segments of said circuit board and which comprises a polyimide layer and a rigid dielectric substrate, and wherein said rigid dielectric substrate contacts said at least one conductive layer;
- (c) at least one rigid bonding layer located on top of said at least one sub-composite and at the rigid segments of said board but not at the flexible segments of said board;
- and
- (d) a second conductive layer on top of said at least one rigid bonding layer.
Dependencies are inferred from the claim text.