Multi-chamber integrated process system

In an integrated module multi-chamber vacuum processing system including a plurality of processing chambers capable of being vacuum evacuated, a substrate transferring chamber capable of being vacuum evacuated, at least one load-lock chamber capable of being vacuum evacuated, a substrate transferring robot assembly for transferring a substrate between the at least one load-lock chamber and the processing chamber, the substrate transferring robot assembly comprising:

• a baseplate rotatable with respect to the substrate transferring chamber;
• two waiting stages integrated on the baseplate to store the substrate temporarily;
• and
• a substrate transferring robot mounted on the baseplate for transferring the substrate.

In an integrated module multi-chamber vacuum processing system for processing substrates, the system comprising a plurality of processing chambers, a substrate transferring chamber, at least one load-lock chamber and a substrate transferring robot assembly, a method of exchanging a processed substrate with an unprocessed substrate comprising the steps of:

• after a thin film deposition process is completed, opening a gate valve of a processing chamber;
• removing a processed substrate from the processing chamber by the use of a substrate mechanical hand of the substrate transferring robot assembly;
• placing the removed substrate on a first waiting stage of the substrate transferring robot assembly;
• grasping, using the substrate mechanical hand, an unprocessed substrate placed on a second waiting stage of the substrate transferring robot assembly;
• transferring the unprocessed substrate into the processing chamber;
• and
• closing the gate valve of the processing chamber.