Low profile fan body with heat transfer characteristics

A cooling apparatus for an electronic device, comprising:

• an air movement device formed around a central axis, said air movement device defining a device depth region in reference to said central axis;
• and
• a heat transfer body, including
• a pressure differential surface formed around the outer perimeter of said air movement device within a first portion of said device depth region,
• a frame for supporting said air movement device, said frame forming at least a portion of said pressure differential surface, and
• a heat transfer surface, coupled to said pressure differential surface, formed around said air movement device within a second portion of said device depth region, said cooling apparatus forcing air movement along said central axis.

An apparatus for removing heat from a heat generating surface, comprising:

• an air movement device formed around a central axis, said air movement device defining a device depth region in reference to said central axis;
• and
• a heat transfer body, including
• an interface surface for coupling to said heat generating surface,
• a pressure differential surface formed around the outer perimeter of said air movement device within a first portion of said device depth region,
• a frame for supporting said air movement device, said frame forming at least a portion of said pressure differential surface, and
• a plurality of heat paths, positioned between said frame and said interface surface, within a second portion of said device depth region.

A device for cooling an electronic component having an exposed surface, said device comprising:

• a heat transfer body adapted to be engaged with said surface, said body having
• an airflow passageway adapted to receive and discharge cooling air to cool said surface, and
• heat transfer means positioned in said air flow passageway to enhance the heat transfer capacity of said heat transfer body;
• and
• a means for moving air disposed in said passageway to create an air flow therethrough;
• said heat transfer body and said air moving means having substantially equal dimensions in a direction normal to said surface.