Method for degolding or tinning conductive portions of a microelectronic device

A method for processing a microelectronic device having a face with electrically conductive elements arranged thereon, comprising the steps of:

• providing a vessel for containing a solder melt, and a bowl having an upper rim which extends in a horizontal plane, said upper rim being formed by an upwardly directed edge;
• immersing the bowl in the solder melt contained in the vessel;
• lifting the bowl to a position where at least said upper rim is located above the solder melt contained in the vessel, whereby molten solder is drawn by the bowl;
• dipping said conductive elements of the device into the molten solder drawn by the bowl;
• separating said conductive elements from the molten solder drawn by the bowl;
• and, immediately after the separation, spinning the device about a substantially vertical axis,
• wherein said spinning step comprises a first phase of submitting the device to a selected angular acceleration, a second phase, having a selected duration, of spinning the device at a selected maximum rotational velocity, and a third phase of submitting the device to a selected angular deceleration.