Back to results
US 5,287,774 AGranted
Method and device for producing seamless ribbon and wire loops, and their use as cuttings tools in ribbon and wire saws
AssigneeWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
InventorDieter Seifert
Life of this patent
Estimating the term…
Abstract
The precise cutting of thin wafers from blocks or rods of hard and brittle material by means of ribbon or wire saws requires a very high strength of the sawing ribbon material or sawing wire material. In the method according to the invention, seamless metal rings are cold-rolled to form ribbon loops, optionally divided to form narrower ribbon loops or to form wire loops and optionally provided with a cutting coating. In this way, extremely strong cutting tools can be obtained.
Claims8
A method for producing seamless wire loops, which comprises the following measures:
- a) preparing a seamless metal ring,
- b) converting the metal ring into a rollable starting ring,
- c) expanding the starting ring by cold rolling to form a thin ribbon loop,
- d) drawing the ribbon loop onto a set of rolls provided with guide grooves,
- e) dividing the ribbon loop into wire loops, said wire loops sliding into said guide grooves.
2 more elements
Dependencies are inferred from the claim text.