Electrically insulated heat pipe type cooling apparatus for semiconductor

An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising:

• a plurality of heat pipe, each heat pipe being divided into a heat adsorption section and a heat dissipation section with an intermediate portion therebetween, the intermediate portion of each heat pipe being provided with an electrically insulated cylinder, at least the heat adsorption section having an open interior without any obstructions therein, the interior of the adsorption section being generally linear with a single central axis, the single central axis of the open interior of the adsorption section being aligned with a central axis of the heat dissipation section and a central axis of the intermediate portion of the heat pipe;
• a block for mounting a semiconductor thereon, the block being provided at the heat absorption section of at least one of the heat pipes;
• a single block, water-cooled jacket structure provided at the heat dissipation section of the plurality of heat pipes such that the water-cooled jacket surrounds a plurality of dissipation sections, said water-cooled structure having a single water inlet and a single water outlet for flow of cooling water through the jacket structure to simultaneously cool the plurality of dissipation sections;
• and
• flow control means within the water-cooled jacket for controlling flow of cooling water through the jacket, the flow control means comprising at least one baffle plate provided in an interior of the water-cooled jacket, the at least one baffle plate controlling the flow of water from the single inlet to the single outlet of the water-cooled jacket.