Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section
AssigneeKabushiki Kaisha Toshiba
InventorsHirokazu Hirano, Bunshiro Yamaki
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Abstract
A semiconductor sensor with a compact structure is provided, which comprises a semiconductor substrate, a semiconductor diaphragm integrally formed with the semiconductor substrate, and a penetrating aperture formed in the semiconductor substrate so as to surround desired sides of the diaphragm. The aperture has first and second funnel-shaped aperatures whose intersecting conic sections open toward opposite directions. A cavity for defining the diaphragm is provided when the semiconductor substrate is subjected to electrolytic etching to form the second funnel-shaped aperture therein.
Claims8
A semiconductor sensor comprising:
- a semiconductor substrate of a first conductivity type having upper and lower surfaces;
- a semiconductor diaphragm defined by a cavity formed in said semiconductor substrate;
- a penetrating aperture provided in said semiconductor substrate to surround desired sides of said diaphragm;
- and
- said aperture including a first section having a first depth and a second section having a second depth deeper than said first depth,
- wherein said first section includes a first opening portion having a first diameter in the upper surface and said second section includes a second opening portion having in the lower surface a second diameter larger than said first diameter, and said first section communicates with said second section through a common opening portion having a third diameter smaller than said first diameter.
Dependencies are inferred from the claim text.