Semiconductor package with segmented lead frame

A semiconductor package for housing a semiconductor die and further for accepting and holding a plurality of connecting leads, comprising:

• a generally rectangular package body having a cavity for accepting a semiconductor die;
• and
• a lead frame, said lead frame including all of the leads in said package body wherein said lead frame includes a plurality of lead frame segments the lead frame segments together including all of the leads of said lead frame and being such that the lead frame is formed when said lead frame segments are assembled into the package body and secured in place therein, the lead frame segments including at least two leads each, the lead frame segments being positioned such that said lead frame is formed by the plurality of lead frame segments;
• a rectangular floor within the cavity of said package to which the semiconductor die is secured;
• and
• a closure means for closing said cavity so as to protect said semiconductor die;
• wherein, each of the leads of each of the lead frame segment is joined to the other leads of the same lead frame segment by a joining strip such that the lead frame segment includes the joining strip and all of the leads of that lead frame segment and further wherein at least one of said lead frame segments has a voltage place attached to one of the leads thereof at the end of the lead opposite the joining strip, the voltage plane being a generally flat extension of the lead formed to fit within the semiconductor package.