Method of preparing high temperature superconductor films on opposite sides of a substrate
AssigneeConductus, Inc.
InventorsNathan Newman, Aharon Kapitulnik, Brady F. Cole, Randy W. Simon
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Abstract
A superconducting electronic circuit device, useful when impedance matching is desired, especially suited to microwave frequencies, consisting of a thin dielectric layer with superconducting layers on both sides. A superconductor such as Yttrium Barium Copper Oxide (YBCO) is formed on a first substrate such as lanthanum aluminate. A protective layer like gold is deposited on the YBCO and a second carrier substrate is bonded to the protected YBCO. The first substrate is then thinned into a thin dielectric film and a second layer of superconductor is epitaxially grown thereon to create the desired circuits.
Claims31
A method of making superconducting electronic structures with superconducting layers on opposite sides of a thin dielectric layer comprising the steps of:
- forming a first layer of superconducting material on a first mechanically stable substrate;
- forming a protective layer on said first layer of superconducting material;
- attaching a second mechanically stable carrier substrate to said protective layer;
- thinning said first substrate to form a thin dielectric layer;
- and
- forming a second layer of superconducting material on the side of said dielectric layer opposite from said protective layer.
A method of making superconducting microwave devices comprising the steps of:
- forming a first layer of superconducting material on a first substrate;
- forming a protective layer on said first layer of superconducting material;
- attaching a second substrate to said protective layer;
- thinning said first substrate to a thickness in the range of about 1 to 250 microns to form a dielectric layer suitable for the microwave region of the spectrum;
- and
- forming a second layer of superconducting material on said dielectric layer to form signal conveying circuits.
A method of thinning a substrate for superconducting electronic structures comprising the steps of:
- forming a layer of superconducting material on a mechanically stable first substrate;
- forming a protective layer on said layer of superconducting material;
- attaching a mechanically stable carrier substrate to said protective layer;
- and
- thinning said first substrate while said first substrate is supported by said carrier substrate.
A method of making electronic structures with high T.sub.c superconducting layers on opposite sides of a thin dielectric layer, comprising the steps of:
- forming a first layer of high T.sub.c superconducting material on a first mechanically stable substrate;
- attaching a second mechanically stable substrate to said first layer of high T.sub.c superconducting material;
- thinning one of said first and second substrates to form a thin dielectric layer;
- and
- forming a second layer of high T.sub.c superconducting material on the side of said dielectric layer opposite from said first layer of high T.sub.c superconducting material.
Dependencies are inferred from the claim text.