Post fabrication processing of semiconductor chips
AssigneeDigital Equipment Corporation
InventorJohn B. Dion
Life of this patent
Estimating the term…
Abstract
A method for for processing semiconductor chips which deters the formation of "tin whiskers" and which removes excess substrate material from the passive side of a semiconductor device is presented. The deterrence of tin whiskers is accomplished by controlling the size of the bead of flowable metal on the conductive bump. The removal of excess material from the passive side of the semiconductor device is accomplished by chemical reaction after the formation of the conductive bump.
Claims2
A method for removing a barrier metal layer from a semiconductor device comprising the step of exposing the said semiconductor device to a solution containing a peroxide and oxidized ammonium persulfate.
Dependencies are inferred from the claim text.