Test circuit for imaging sensing integrated circuits
AssigneeThe University of Edinburgh
InventorsPeter B. Denyer, David Renshaw
Life of this patent
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Abstract
The design and testing of integrated circuits in wafer form for production faults, in the absence of irradiation, is described. This is achieved by fabricating test circuits on each wafer at the periphery of the sensor array. In a preferred arrangement, two test circuits are fabricated on each wafer; one for testing the word lines and the other for testing the bit lines and individual sensing sites. The test circuits are controlled by external signals to input predetermined patterns of data to the array and the array output patterns are compared with the input patterns to assess the level of production faults.
Claims10
An image sensing integrated circuit (IC) having a sensor array comprising a multiplicity of radiation sensing sites, a plurality of word-lines and a plurality of bit-lines, each sensing site being capable of storing an analog charge packet for a predetermined period, said sensor array being coupled on-board to signal read-out means for providing an output signal from said sensor array, said sensor array being coupled to on-board digital test circuit means disposed at the periphery of the array, said on-board digital...test circuit means being responsive to a control signal to generate a digital test signal for testing the integrity of at least one of a plurality of the sensor array bit-lines and a plurality of the sensor array word-lines in the absence of test irradiation on said sensing sites, and on-board monitoring and read-out means coupled to said sensor array for monitoring an output signal from said sensor array corresponding to said digital test signal to output the detected states of the word-lines, bit-lines or individual sensing sites to identify the level of production faults in said IC in the absence of test irradiation.
A method of testing image array sensors at the wafer stage for manufacturing faults, said method comprising the steps of,
- fabricating said wafer with on-board digital test circuit means located at the periphery of the array, coupling said on-board digital test circuit means to an external signal source,
- in response to a signal from said external test signal source generating a predetermined input digital test signal from said on-board digital test circuit means, applying said predetermined digital test signal to at least one of a plurality of sensor array bit-lines and a plurality of sensor array word-lines of said sensor array, monitoring an output signal from said sensor array corresponding to said predetermined digital test signal and comparing the input and output signals to identify the level of production faults in said integrated circuit in the absence of test irradiation.
Dependencies are inferred from the claim text.