Laser bonding scheme
AssigneeAT&T Bell Laboratories
InventorErnest E. Bergmann
Life of this patent
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Abstract
An arrangement for providing improved efficiency in laser bonding is disclosed. In particular, at least one piece part in the arrangement is formed to include means for concentrating a beam of radiation at a predetermined attachment location (or several locations). The concentrating means may be in the form of an aperture, such as a conical or parabolic opening, which will concentrate the radiation to the area of interest. Alternatively, if the piece part is transparent to the wavelength of the radiation, the concentrating means may be in the form of a lens or grating formed on the surface of the piece part.
Claims18
In an arrangement including a first piece part and a second piece part wherein said first piece part is to be laser bonded to said second piece part in at least one predetermined attachment site, at least one piece part including as a physical feature means for concentrating radiation from said laser toward said at least one predetermined attachment site.
A laser bonding process comprising the steps of:
- a) providing a first piece part and a second piece part, at least one piece part including as a physical feature means for concentrating laser radiation toward at least one predetermined attachment site used to join said first piece part to said second piece part;
- b) radiating said first and second piece parts with a laser such that the radiation impinges said concentrating means and is directed to the at least one attachment site;
- and
- c) maintaining the radiation of step b) for a time period sufficient to provide bonding of said first and second piece parts.
Dependencies are inferred from the claim text.