Integrated circuit having metal substrate

An integral circuit having a metal substrate, comprising:

• a first circuit board in which a conductive layer of desired pattern is formed on said metal substrate through an insulating layer;
• a memory device nondetachably mounted on said first circuit board and storing nonvolatile data which can be rewritten by an external operation;
• a controlling device mounted on said first circuit board and connected to said memory device and performing a predetermined controlling operation based on the nonvolatile data stored in said memory device;
• a first connector, mounted on said first circuit board, and having a first group of terminals connected to a first path for passing control signals from said controlling device to an external object which will be electrically controlled by said controlling device;
• a second connector, mounted on said first circuit board, arranged separately from said first connector and externally accessible, and having a second group of terminals connected to a detachable second path, for passing signals to rewrite the nonvolatile data in said memory device responsive to the external operation performed by an external processing device via the second path which is different from the first path in said first connector, said second connector having a female-connector shape so that said second connector can be sealed by filling a resin after rewriting of the nonvolatile data stored in said memory device;
• and
• seal means for sealing an outer surface of said first circuit board except said first and second connectors so that said first and second connectors are exposed to the outside.