Bonding metal members with multiple laser beams
AssigneeMicroelectronics and Computer Technology Corporation
InventorsRama R. Goruganthu, Philip J. Spletter
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicroelectronics and Computer Technology Corporation
InventorsRama R. Goruganthu, Philip J. Spletter
Estimating the term…
A first laser beam and a second laser beam with a longer wavelength than the first laser beam are directed at a first metal member in contact with a second metal member. At the ambient temperature the first member has high absorption of energy from the first laser beam but low absorption of energy from the second laser beam. As the first member absorbs energy from the first laser beam the temperature of the first member increases and the reflectivity of the first member decreases so that the first member has high absorption of energy from the second laser beam. The first member then absorbs energy from the second laser beam, the temperature of the first member further increases and at least one of the members melts. After discontinuing the laser beams a solid bond forms between the members.
A method of using multiple laser beams to bond metal members, comprising:
A method of using multiple laser beams to bond metal members, comprising:
An apparatus with multiple laser beams for bonding metal members, which comprises:
An apparatus with multiple laser beams for bonding metal members, which comprises:
Dependencies are inferred from the claim text.