Slitter machine for use in manufacturing semiconductor devices
AssigneeAmkor Electronics, Inc.
InventorFrank J. Johnson
Life of this patent
Estimating the term…
Abstract
A slitter machine for slitting a film sheet wound on a core in a roll to obtain desired widths of film sheet for laminating onto metallic substrates of semiconductor devices comprises a main frame, notches on the main frame for rotatably supporting the roll on the frame, a rotatable knife blade for slitting the roll sheet into a strip of desired width, a tiltable knife blade mounting plate on the frame for mounting the knife blade on the frame, guide tracks adjusting the lateral position of the knife blade to adjust the width of the strip being cut, an air cylinder for pressing the knife blade into the rolled sheet to cut the sheet into strips of the desired width, and a sensing roller for limiting the depth of the cut.
Claims10
A slitter machine for slitting a film sheet wound on a core in a roll to obtain desired widths of film sheet for laminating onto metallic substrates of semiconductor devices comprising:
- a main frame,
- means on the main frame for rotatably supporting the roll on the frame in a freely rotatable condition,
- a single rotatable knife blade for slitting the roll sheet into a strip as the strip is being peeled off the roll,
- knife blade mounting means on the frame for freely rotatably mounting the knife blade on the frame,
- means for tiltably advancing the knife blade in the direction of the roll,
- means for adjusting the lateral position of the knife blade to adjust the width of the strip being cut,
- means for pressing the knife blade into the rolled sheet as the strip is being pulled from the roll to cut the sheet into a strip,
- and means for limiting the depth of the cut so that the knife blade does not cut into the core on which the film sheet is wound.
A slitter process for slitting a roll of film sheet wound on a core to obtain strips of film sheet of varied desired widths for laminating onto metallic strips of the same widths of substrates of semiconductor devices, comprising:
- freely rotatably supporting a roll of film sheet wound on a core and having a first end and first end edge at one end of the roll and a second end and a second end edge at the other end of the roll,
- freely rotatably mounting a single rotatably knife blade at a start position means near the roll at a desired distance from the first end edge of the roll,
- tiltably advancing the knife blade in the direction of the roll,
- pressing the knife blade into the roll,
- slitting the roll of film sheet with the knife blade to form a slit and a strip of desired width from the first end of the roll, with said strip having two strip edges with one strip edge being the first end edge of the roll and the other strip edge being an edge of the slit,
- unwinding the strip from the roll by pulling the strip from the first end of the roll to cause the slitting of the roll,
- rotating the roll by pulling the strip from the first end of the roll as the strip is being formed by the slitting,
- simultaneously rotating the knife blade by pulling the strip from the first end of the roll as the strip is being formed by the slitting,
- and limiting the depth of the slit so that the knife blade does not cut into the core.
A slitter process for slitting a roll of film sheet wound on a core to obtain strips of film sheet of varied desired widths for laminating onto metallic strips of the same widths of substrates of semiconductor devices, comprising:
- providing a single rotatable knife blade
- providing knife blade mounting means which comprises:
- guide tracks (29a,29b) mounted on top of the frame (17) for guiding the knife blade mounting means in sidewise movement to position the knife blade at the proper position for cutting a strip (15) of the roll (12) sheet at a desired width,
- a bottom plate (31) mounted on the guide tracks (29a, 29b) and having a front end (31a) and a rear end (31b), a pair of support arms (33, 35) each having a rear end portion (33a, 35a) and a front end portion (33b, 35b) with a longitudinal slot (33c, 35c) in the front end portion (33a, 35a,),
- bolt pivot means (39a, 39b) for pivotally connecting the rear end portion of (33a, 35a) of the support arms (33, 35) to the rear end portion (31b) of the bottom plate 931),
- a tiltable support plate (41),
- bolt pivot means (43a, 43b) pivotally connecting the support plate (41) to the front end portions of the support arm (35) through the slots (35c) in the support arm (35) for adjusting the attitude assumed by the support plate (41),
- said support plate (41) having a front surface (41a) and a rear surface (41b),
- a notch (45) in the rear surface (41b) of the support plate (41) in its bottom portion for contacting the front end (47) of the bottom plate (41) no matter what attitude the support plate (41) assumes,
- a pair of blade support rods (49a, 49b) connected at their bottom portions to a transverse shaft (51) on which the blade (19) is rotatably mounted,
- mounting means on the support plate (41) for mounting the blade supports rods (49a, 49b) on the support plate (41) and for aligning rods (49a, 49b) properly and for permitting slidable movement of the blade support rods so that the blade may be continuously extended to contact the roll to progressively cut the sheet into a strip of desired width,
- means for limiting the depth of cut including a sensing roller (59) operatively connected to the shaft (51) of the knife blade (19) for contacting the roll (12) and limiting the depth of the cut, and
- means for pressing said means for limiting the depth of the cut,
- wherein said pressing means is an air cylinder (57) mounted on the support plate (41) and connected to the shaft (51) of the knife blade (19) for continuously pushing the knife blade (19) and the sensor roller (59) of the depth control means,
- rotatably mounting the blade (19) onto transverse shaft (51),
- guiding the knife blade (19) in sidewise movement to position the knife blade (19) at the proper position for cutting a strip (15) of the roll (12) at a desired width to match the width of a metallic strip of substrates of semiconductor devices,
- tilting the support plate (41) and adjusting its attitude so that the blade contacts the roll,
- contacting the front end (47) of bottom plate (31) with notch (45) in the rear surface (41b) of the support plate (41) no matter what attitude the support plate (41) assumes,
- aligning the rods (49a, 49b) properly and permitting slidable movement of the blade support rods (49a, 49b) so that the blade (19) is continuously extended to contact the roll to progressively cut the sheet into a strip of desired width,
- freely rotatably supporting a roll of film sheet wound on a core, said roll having a first end and first end edge at one end of the roll and a second end and a second end edge at the other end of the roll,
- freely rotatably mounting the single rotatable knife blade at a start position near the roll at a desired distance from the first end edge of the roll,
- tiltably advancing the knife blade in the direction of the roll,
- pressing the knife blade into the roll,
- slitting the roll of film sheet with the knife blade to form a slit and a strip of desired width from the first end of the roll, with said strip having two strip edges with one strip edge being the first end edge of the roll and the other strip edge being the other edge of the slit,
- unwinding the strip from the roll by pulling the strip from the first end of the roll,
- rotating the roll by pulling the strip from the first end of the roll as the strip is being formed by the slitting,
- simultaneously rotating the knife blade by pulling the strip from the first end of the roll as the strip is being formed by the slitting,
- and limiting the depth of the slit so that the knife blade does not cut into the core.
Dependencies are inferred from the claim text.