Confined water fixture for holding wafers undergoing chemical-mechanical polishing

A method for supporting a wafer to be polished, said method comprising:

• providing a flexible, non-porous template having a recessed pocket with predetermined inner dimensions for receiving said wafer,
• providing a carrier for supporting said template,
• fixing said template to said carrier, providing a washer having outer dimensions substantially the same as the inner dimensions of said pocket, placing a first film of liquid within said pocket,
• providing a porous pad having a non-porous sheath on one surface thereof,
• placing said porous pad to overlie said liquid with said sheath facing said liquid,
• placing said washer, relative to said pocket, to confine said liquid in cooperation with said sheath and said template pocket,
• saturating and covering said porous pad with a second liquid film, and
• floating said wafer on said second liquid film.

A wafer polishing apparatus having a fixture comprising a flexible, non-porous template having a recessed pocket with predetermined inner dimensions for receiving a wafer to be polished,

• a carrier for supporting said template, said template being fixed to said carrier,
• a washer having outer dimensions substantially the same as the inner dimensions of said pocket,
• a first film of liquid within said pocket,
• a porous pad overlying said liquid and having a non-porous sheath on the pad surface facing said liquid,
• said washer being located, relative to said pocket, to confine said liquid in cooperation with said sheath and said template pocket,
• a second liquid film saturating and covering said porous pad,
• said wafer floating on said second liquid film, and
• a polishing member adapted to be positioned in contact with said wafer for polishing said wafer.