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US 5,266,612 AGranted
Imide epoxy resin composition for sealing semiconductor elements
AssigneeCheil Industries Inc.
InventorsWhan G. Kim, Ji Y. Lee
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Abstract
An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical, n denotes 0 or an integer of 1 above.
Claims2
An epoxy resin composition for sealing semiconductor elements comprising:
- an o-cresol-novolak epoxy resin, an imide-epoxy resin, a phenol-novolak curing agent, a triphenyl-phosphine curing accelerator promoter, and an inorganic filler, wherein the imide-epoxy resin is represented by the formula (I), as follows:
- ##STR4## wherein, R.sub.1 and R.sub.2 denote independently, H or a-(CH.sub.2).sub.n CH.sub.3 radical, and n denotes 0 or an integer of 1 or above.
Dependencies are inferred from the claim text.