Method of dicing semiconductor wafer with diamond and resin blades
AssigneeFujitsu Limited
InventorYutaka Yamada
Life of this patent
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Abstract
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix into a large number of chips by the use of a diamond blade, includes the steps of first cutting by the use of the diamond blade in such a manner as to leave a partial residual portion or portions in a direction of thickness of the wafer and to define a plurality of grooves on the wafer in transverse and longitudinal directions, and then cutting the wafer along the grooves by the use of a resin blade having a width equal to or smaller than that of the diamond blade while a feed speed thereof is kept lower than that of the diamond blade.
Claims5
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix and having a tape provided on a back of the semiconductor wafer into a large number of chips by the use of a diamond blade, comprising the steps of:
- first effecting cutting by use of said diamond blade so as to leave a partial residual portion or portions in a direction of thickness of said wafer and to define a plurality of grooves on said wafer in transverse and longitudinal directions;
- and
- then cutting said wafer along said grooves so that the cutting reaches a surface of the tape by the use of a resin blade having a width equal to or smaller than that of said diamond blade while a feed speed thereof is kept lower than that of said diamond blade.
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix into a large number of chips, the semiconductor wafer further having a tape adhered to a back surface thereof, said method comprising the steps of:
- selecting a diamond blade for initially cutting the wafer;
- cutting with the diamond blade so as to leave a partial residual portion or portions in a direction of thickness of the wafer therein defining a plurality of grooves on the wafer in transverse and longitudinal directions;
- selecting a resin blade having a width equal to or smaller than that of the diamond blade for final cutting of the wafer;
- and
- cutting the wafer with the resin blade at a feed speed lower than that used with the diamond blade along the grooves so that said cutting reaches a surface of the tape.
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix into a large number of chips, said method comprising the steps of:
- mounting an adhesive tape to a back surface of the semiconductor wafer;
- selecting a diamond blade for initially cutting the wafer;
- cutting with the diamond blade so as to leave a partial residual portion or portions in a direction of thickness of the wafer therein defining a plurality of grooves on the wafer in transverse and longitudinal directions;
- selecting a resin blade having a width equal to or smaller than that of the diamond blade for final cutting of the wafer;
- and
- cutting the wafer with the resin blade at a feed speed lower than that used with the diamond blade along the grooves so that said cutting reaches a surface of the adhesive tape.
Dependencies are inferred from the claim text.