Process for manufacturing a multilayer integrated circuit interconnection
AssigneeThomson-CSF
InventorsJean-Marc Bureau, Francois Bernard, Dominique Broussoux, Claude Vergnolle
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Abstract
The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.
Claims11
A method for producing a multilayer polymer-metal system for interconnection of integrated circuits, compatible with two-dimensional electrical or optical connections, comprising the sequential steps of:
- (a) forming a multilayer interconnection system on a rigid substrate;
- (b) forming at least one integrated circuit on said multilayer interconnection system;
- and
- (c) removing said rigid substrate from said multilayer interconnections system, thereby leaving a self-supporting multilayer connection system.
Dependencies are inferred from the claim text.