US 5,258,706 AGranted

Method for the recognition of testing errors in the test of microwirings

AssigneeSiemens Aktiengesellschaft

InventorsMatthias Brunner, Ralf Schmid

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Abstract

Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW 2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.

Claims6

Dependent claims

A method for recognizing testing errors in a test, particularly an electron beam test of microwirings in the form of a printed circuit board having a plurality of networks, each network of the plurality of networks having a plurality of contact points, wherein interruptions in the networks are identified, comprising the steps of:

providing all contact points with a reference potential before a beginning of a main test;
charging a respective network not yet intentionally charged to a charging potential differing from the reference potential in a first step of the main test via a contact point of the respective network;
measuring respective potentials or contact points not intentionally charged in the respective network in a second step of the main test;
identifying an interruption in the respective network in a third step of the main test in that an interruption contact point of the respective network is not charged to the charging potential via a line of the respective network;
intentionally charging the respective interruption contact point to the charging potential in a first step of a follow-up test;
measuring potentials of contact points not intentionally charged in the follow-up test in the respective network in a second step of the follow-up test;
confirming a respective interruption identified in the third step of the main test in a third step of the follow-up test if at least one contact point of the respective network was not charged to the charging potential via a line of the respective network;
and
identifying a testing error that arose in the main test when the respective interruption identified in the third step of the main test is not confirmed.

6 more elements

method for the recognition of testing errors in a test, particularly an electron beam test of microwirings in the form of a printed circuit board having a plurality of networks, each network of the plurality of networks having a plurality of contact points, wherein shorts between networks are identified, comprising the steps of:

providing all contact points with a reference potential before a beginning of a main test;
intentionally charging at least one a respective network not yet intentionally charged to a charging potential differing from the reference potential in a first step of the main test via at least one contact point of the respective network;
measuring potentials of at least one other network not yet intentionally charged via at least one contact point of the respective, other network in a second step of the main test;
identifying a respective short from the at least one respective network already intentionally charged to the respective, at least one other network not yet intentionally charged in a third step of the main test in that at least one short-circuit point of the respective, other network not yet intentionally charged was charged to the charging potential via the respective short;
discharging all contact points before a follow-up test;
intentionally charging the network of the respective short-circuit circuit contact point to the charging potential in a first step of the follow-up test;
identifying potentials of networks not yet intentionally charged in the follow-up test in a second step of the follow-up test in that the potential is respectively measured via at least one contact point of the respective network not yet intentionally charged in the follow-up test;
confirming a respective short identified in a third step of the main test in a third step of the follow-up test if a network not yet intentionally charged in the follow-up test is charged to the charging potential via the respective short;
and
identifying a testing error that occurred in the main test when the respective short found in the third step of the main test is not confirmed.

7 more elements

Dependencies are inferred from the claim text.