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US 5,256,578 AGranted
Integral semiconductor wafer map recording
AssigneeMotorola, Inc.
InventorsDean Corley, Hugh W. Littlebury
Life of this patent
Estimating the term…
Abstract
A method for integral semiconductor wafer map recording which comprises a semiconductor wafer (11) having a plurality of individual die (12, 13) thereon. Testing each of the individual die (12). Summarizing the results of the testing in a wafer map. Recording the wafer map on the semiconductor wafer (11) by laser scribing a binary code (19) within inactive die (13).
Claims8
A method for integral semiconductor wafer map recording, comprising:
- providing a semiconductor wafer;
- fabricating a plurality of active die and a plurality of inactive die on a surface of the semiconductor wafer;
- testing the active die;
- summarizing the results of the testing in a wafer map;
- compressing the wafer map to produce a binary code;
- and
- recording the binary code by laser scribing within at least one of the inactive die.
4 more elements
A method for integral semiconductor wafer map recording, comprising:
- providing a semiconductor wafer;
- fabricating a plurality of active die on the semiconductor wafer;
- additionally fabricating a plurality of test patterns on the semiconductor wafer;
- testing each of the active die;
- categorizing each die based on the testing results;
- summarizing the results of the categorization in a wafer map;
- compressing the wafer map to produce a binary code;
- recording the binary code by computer controlled laser scribing of a machine readable binary code within one of the test patterns;
- further recording a plurality of redundant copies of the binary code within a plurality of test patterns which are positioned at different locations on the semiconductor wafer;
- and
- reading the binary code from the test patterns by means of video and computer equipment.
8 more elements
Dependencies are inferred from the claim text.