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US 5,256,562 AGranted
Method for manufacturing a semiconductor device using a circuit transfer film
AssigneeKopin Corporation
InventorsDuy-Phach Vu, Brenda D. Dingle, Jason E. Dingle, Ngwe Cheong
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Abstract
The invention relates to the formation of arrays of thin film transistors (TFT's) on silicon substrates and the dicing and tiling of such substrates for transfer to a common module body.
Claims16
The process of forming electronic circuitry on a common body comprising the steps of:
- a) forming a plurality of electronic circuits in a semiconductor film formed on a substrate;
- b) dividing the substrate into a plurality of tiles;
- c) transferring said tiles to a common body;
- d) registering the tiles on said common body;
- e) adhering said tiles to the common body;
- f) removing the substrates tiles, leaving the circuits on the body;
- and
- g) simultaneously forming circuit elements on said circuits so that each such element is aligned with each other element.
5 more elements
The process of forming transistors and pixel electrodes for an active matrix liquid display comprising the steps of:
- a) forming a plurality of transistors in a first semiconductor film formed on a first substrate;
- b) dividing the substrate into circuit tiles and transferring said tiles to a common body;
- c) removing the substrates from the tiles leaving the transistors on the body;
- d) forming electrodes on the tiles adjacent the transistors.
1 more element
Dependencies are inferred from the claim text.