Method and apparatus for deposition of solder paste on a printed wiring board
AssigneeMotorola, Inc.
InventorsGregory S. Shaffer, Anthony R. Weeks
Life of this patent
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Abstract
A method and apparatus for uniformly depositing solder paste on a printed wiring board. A squeegee arrangement applies solder paste through a stencil to a surface of a printed wiring board. As the squeegee assembly is moved in one planar direction over the stencil in a planar fashion, it is also vibrated by a vibrator to produce slight circular motion in addition to the planar motion of the squeegee blade.
Claims18
Apparatus for uniform deposition of solder paste on a printed wiring board (PWB) comprising:
- a stencil having a plurality of apertures through two planar surfaces, one planar surface of said stencil placed in contact with one surface of said PWB;
- said solder paste being applied on another planar surface said stencil;
- squeegee application means for applying said solder paste through said plurality of apertures of said stencil to said PWB, said squeegee application means being in contact with the other planar surface of said stencil and with said solder paste;
- and
- means for vibrating said squeegee application means for providing a uniform deposition of said solder paste through each of said plurality of apertures of said stencil to said PWB, said means for vibrating being connected to said squeegee application means.
A method for uniform deposition of solder paste on a printed wiring board (PWB) comprising the steps of:
- placing a surface of a stencil, having a plurality of apertures, in contact with a surface of the printed wiring board;
- depositing the solder paste on another surface of the stencil;
- moving a squeegee across the stencil and the solder paste;
- and
- vibrating the squeegee as it moves across the stencil.
An apparatus for surface mounting components on a printed wiring board (PWB) comprising:
- screen printing means including:
- a stencil having a plurality of apertures through two planar surfaces, one planar surface of said stencil placed in contact with one surface of said PWB;
- solder paste being applied on another planar surface of said stencil;
- squeegee application means for applying said solder paste through said plurality of apertures of said stencil to said PWB, said squeegee application means being in contact with the other planar surface of said stencil and with said solder paste;
- means for vibrating said squeegee application means for providing a uniform deposition of said solder paste through each of said plurality of apertures of said stencil to said PWB, said means for vibrating being connected to said squeegee application means;
- and
- a surface-mounted component being attached to said uniform depositions of said solder paste on said PWB.
Dependencies are inferred from the claim text.