# US 5,253,415 A · Method of making an integrated circuit substrate lead assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,253,415 A - Document ID: US5253415A - Status: Granted - Kind: A - Application number: 07/944,347 - Filed: 1992-09-14 - Granted: 1993-10-19 - Earliest claimed: 1990-03-20 - Assignees: Die Tech, Inc. - Inventors: Richard K. Dennis - Web page: https://patentgrep.com/patent/US5253415A ## CPC - H10P 72/0444: {Apparatus for wiring semiconductor or solid-state device} - H05K 13/06: Wiring by machine - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - Y10T 29/49121: Beam lead frame or beam lead device - Y10T 29/49144: by metal fusion - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads. ## Claims ### Claim 1 The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip comprising the steps of: a. stringing a plurality of individual conductive wire filaments in generally parallel side-by-side relation to form an array of parallel filaments remote from the tape segments; b. providing first and second tape segments remote from the array of parallel conductive wire filaments; c. adhering portions of the filament array to the first and second tape segments so that each segment carries an array of generally parallel wire filaments extending across the segment; d. positioning one segment on top of the other segment with the filaments in the respective arrays on the segments oriented at approximately 90 degrees to each other and adhering the two tape segments to each other; and f. forming a series of chip contact ends on the filaments of each segment array, such ends being located at a chip location on the tape segments and forming board contact ends on the filaments of each segment array, such ends being located away from the chip location. ### Claim 2 (depends on 1) The method of claim 1 including the step of positioning the tape segments with filament arrays intersecting each other at the chip location and removing intersecting filaments. ### Claim 3 (depends on 1) The method of claim 1 including the step of forming flat contact surfaces on the contact ends of the filaments. ### Claim 4 (depends on 1) The method of claim 1 including the steps of forming openings through a tape segment at the chip contact ends and at the board contact ends and bonding the chip contact ends to contact pads on an integrated circuit chip and bonding the filament board contact ends to contact pads on a circuit board with the bonds extending through the openings. ### Claim 5 (depends on 1) The method of claim 1 including the step of inwardly fanning the filaments in each array prior to adhering the filaments to the first and second tape segments so that the chip contact ends are more closely spaced apart than the board contact ends. ### Claim 6 (depends on 1) The method of claim 1 including the including the step of spacing the filaments forming said chip contact ends apart a distance approximately 0.004 to 0.006 inch. ### Claim 7 (depends on 1) The method of claim 1 including the step of positioning the segments so that said arrays intersect each other at a central chip location and removing the intersecting filaments and tape bonded to the intersecting filaments from the lead assembly to form four filament arrays each extending outwardly from the chip location. ### Claim 8 (depends on 7) The method of claim 7 including the step of forming openings in said tape segments at the filaments and extending said filament ends across openings prior to adhering the filaments to the tape segments. ### Claim 9 (depends on 8) The method of claim 8 including the step of forming parallel chip contact ends spaced apart about 0.004 to 0.006 inch, inwardly fanning the filament arrays adjacent such ends and forming straight line connections between the closed spaced inwardly fanned filaments and the chip contact ends. ### Claim 10 (depends on 8) The method of claim 8 including the step of forming parallel chip contact ends spaced apart about 0.004 to 0.006 inch, inwardly fanning the filament arrays adjacent such ends and forming a non-linear line connection between the chip pad ends and the inwardly fanned filaments. ### Claim 11 (depends on 1) The method of claim 1 including the step of adhering the filaments to an indefinite length tape strip and severing said film segments from the tape strip. ### Claim 12 The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip using cylindrical wire filaments comprising the steps of: a. adhering two side-by-side arrays of generally parallel conductive cylindrical wire filaments oriented generally perpendicular to each other to a tape segment with central portions of said filament arrays intersecting each other at a chip location; and b. removing the intersecting portions of the filament arrays and the adhered portion of the tape segment at the chip location to form at least of pair of generally perpendicular arrays of individual filaments having chip contact ends adjacent the chip location and board contact pads located away from the chip location. ### Claim 13 (depends on 12) The method of claim 12 including the step of inwardly fanning said arrays. ### Claim 14 (depends on 13) The method of claim 13 including positioning the board contact ends of said arrays at a center-to-center spacing of about 0.015 to 0.025 inch. ### Claim 15 (depends on 12) The method of claim 12 including the step of positioning the chip location at the center of the tape segment, and removing the intersecting filaments and a rectangular portion of the tape segment at the chip location to form four filament arrays. ### Claim 16 (depends on 12) The method of claim 12 including the step of positioning the chip contact ends in each array at a center-to-center spacing of about 0.004 to 0.006 inch and inwardly fanning said arrays between the board contact ends and the chip contact ends. ### Claim 17 The method of manufacturing a lead assembly for forming electrical connections between contact pads on a board and closely spaced contact pads on an integrated circuit chip comprising the steps of adhering two arrays of side-by-side and inwardly fanned conductive cylindrical wire filaments having a diameter of about 0.001 to 0.003 inch to a tape segment to either side of a chip location with each array including a row of board contact ends exposed through the thickness of the tape segment away from the chip location and a row of chip contact ends exposed through the thickness of the tape segment adjacent to the chip location with the filaments in each array being inwardly fanned between the board contact ends and the chip contact ends so that the chip contact ends are spaced more closely together than the board contact ends; and removing portions of the tape carrier at such ends. ### Claim 18 (depends on 17) The method of claim 17 including forming slots through the tape segment to expose the ends of the filaments. ### Claim 19 (depends on 18) The method of claim 18 including the step of forming flat contact surfaces on ends with the contact surfaces facing outwardly from the tape segment.