Semiconductor device having stacked lead structure
AssigneesHitachi, Ltd., Hitachi Microcomputer
InventorsJunichi Arita, Akihiko Iwaya, Tomoo Matsuzawa, Masahiro Ichitani
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Abstract
Disclosed is a resin-molded type semiconductor device having a thin package while avoiding short-circuit of wires with a common inner lead. In the construction thereof, a common inner lead constituted by a thin metal sheet is fixed onto a circuit-forming surface of a rectangular semiconductor chip substantially in parallel with longer sides of the chip and substantially in a central region of the chip, and a plurality of inner leads for signals, which are in the form of a frame, are stacked and fixed onto the common inner lead; then these components are molded with resin.
Claims44
A semiconductor device comprising:
- a semiconductor chip having on a principal surface thereof a plurality of external terminals;
- leads comprising first leads for providing voltages and second leads for providing signals, each of said first and second leads comprising an inner lead portion having a first part and a second part and an outer lead portion connected to said second part and extending in a direction away from said first part;
- a metal layer interposed between the principal surface of the semiconductor chip and the first part of said inner lead portion of the leads, said first part of said inner lead portion of the leads overlying said metal layer, the metal layer being connected electrically to the first leads;
- and
- a plurality of wires comprising first wires and second wires, said first wires electrically connecting the first part of said inner lead portion of the second leads with a first group of said plurality of the external terminals, said second wires electrically connecting said metal layer with a second group of said plurality of the external terminals.
A semiconductor device comprising:
- a semiconductor chip having on a principal surface thereof a plurality of external terminals;
- leads comprising first leads for providing voltages and second leads for providing signals, each of said first and second leads comprising an inner lead portion having a first part and a second part and an outer lead portion connected to said second part and extending in a direction away from said first part;
- a metal layer stacked on the first part of said inner lead portion of the leads, overlying said first part of said inner lead portion of the leads, and connected electrically to said first leads;
- and
- a plurality of wires comprising first wires and second wires, said first wires electrically connecting the first part of said inner lead portion of the second leads with a first group of the external terminals, said second wires electrically connecting said metal layer with a second group of the external terminals.
Dependencies are inferred from the claim text.