US 5,251,266 A · System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly

Abstract

A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment. The heater array subsystem is utilized to bond the IC device to the circuit board while the mechanical positioning subsystem maintains the IC device in aligned combination with the board.

Claims12

Dependent claims

A guidance type placement apparatus for placing and mounting an integrated circuit device in a predetermined position on a designated placement site of a printed circuit board, comprising:

mechanical positioning means operative for sequentially positioning the printed circuit board and the integrated circuit device for generation of images thereof, for aligning the integrated circuit device with the designated placement site of the printed circuit board, and for placing the integrated circuit device at the designated placement site of the printed circuit board;
image acquisition means for generating an image corresponding to at least one pair of opposed corners of the designated placement site superimposed and overlapped by at least one pair of opposed corners of the integrated circuit device to define a location and orientation of the integrated circuit device relative to the designated placement site;
and
a control system, coupled to said image acquisition means, for providing, in response to said image, a feedback control signal to said mechanical positioning means such that said mechanical positioning means may iteratively regulate placement of the integrated circuit device at the designated placement site.

1 more element

A placement apparatus, for placing a circuit component on a designated placement site of a printed circuit board, said apparatus comprising:

an optical system for providing an image having a first image portion corresponding to at least a portion of the component and having a second image portion corresponding to at least a portion of the placement site, wherein the first image portion is superimposed and overlapped by the second image portion to define a position and an orientation of the component relative to the designated placement site;
a positioning system operative for sequentially positioning the printed circuit board and the component and for aligning the component with the designated placement site of the printed circuit board, and for placing the component on the designated placement site;
and
a control system, coupled to said positioning system and said optical system, for receiving an image signal from said optical system wherein said image signal is representative of the image provided by said optical system and for providing a feedback control signal to said positioning system wherein the feedback control signal is provided in response to the image signal and wherein the feedback control signal regulates placement, by said positioning system, of the component at the designated placement site of the printed circuit board.

1 more element

Dependencies are inferred from the claim text.

System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly

Life of this patent

System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly

Life of this patent

Abstract

Claims12