Silver-rich conductor compositions for high thermal cycled and aged adhesion
AssigneeE. I. Du Pont de Nemours and Company
InventorsHiroyuki Hara, Marc H. La Branche, Barry E. Taylor
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Abstract
The invention is directed to a thermal cycle adhesion additive composition consisting essentially of an admixture of finely divided particles of oxides of bismuth, copper, lead, zinc, and transition metal and to conductive thick film compositions made therefrom.
Claims19
A composition for making solderable electrically conductive layers comprising an admixture of finely divided particles containing by weight % (1) 85-99.9% of at least one solderable electrically conductive metal and (2) 15-0.1% of a additive composition consisting essentially of an admixture of finely divided particles of oxides or precursors of oxides of bismuth, copper, lead, zinc and a transition metal selected from iron, cobalt, nickel and mixtures thereof in which the weight ratio of (a) copper oxide to bismuth oxide and lead oxide is 0.01-2, (b) lead oxide to bismuth oxide and lead oxide is 0-1, (c) zinc oxide to bismuth oxide and lead oxide is 0.01-2, (d) transition metal oxide to bismuth oxide and lead oxide is 0.01-2.
Dependencies are inferred from the claim text.