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US 5,249,450 AGranted
Probehead for ultrasonic forging
AssigneeMicron Technology, Inc.
InventorsAlan G. Wood, David R. Hembree, Warren M. Farnworth, Larry D. Cromar
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AssigneeMicron Technology, Inc.
InventorsAlan G. Wood, David R. Hembree, Warren M. Farnworth, Larry D. Cromar
Estimating the term…
A wirebond probe head is modified for use in forming raised portions from material. The modified head includes a main portion and a sleeve, with the sleeve functioning as a shroud to reduce the tendency of forged material to exude from the periphery of the wirebond probe. The sleeve may also be vibrationally isolated from the main portion of the head in order to attenuate vibrational energy transferred from the main portion of the head to the sleeve. The inventive head functions by being brought into close proximity to a surface material and applying energy. This results in an ultrasonically formed elevated surface irregularity, or an ultrasonic forging splash, which useful as an electrical contact pad for permanent and semipermanent electrical connections.
A head for use in ultrasonic forging comprising:
A head for use in ultrasonic forging comprising:
A head for use in ultrasonic forging with an ultrasonic forging device comprising:
Dependencies are inferred from the claim text.