High-vacuum substrate enclosure

An evacuated substrate enclosure comprising:

• a substrate, having first and second major surfaces and defining an aperture therebetween;
• a plate;
• a sidewall having first and second substantially parallel surfaces, the sidewall being disposed between one of the first and second surfaces of the substrate and the plate to define an encapsulated region therebetween;
• an encapsulation member proximally disposed with respect to the other of the first and second surfaces of the substrate, the encapsulation member defining an aperture therethrough and the encapsulation member and substrate defining an encapsulated region therebetween;
• and
• a sealing agent disposed in interfaces between the plate and the sidewall, between the sidewall and the substrate and between the encapsulation member and the substrate to effect a vacuum seal at the interfaces such that when the defined encapsulated areas are evacuated the encapsulated areas will be at substantially the same vacuum levels to provide for substantially no differential pressure induced deformation of the substrate.

An evacuated substrate enclosure comprising:

• a substrate, having first and second major surfaces and defining an aperture therebetween;
• an encapsulation member defining an aperture therethrough and having a supporting surface, the substrate being disposed on a part of the supporting surface and defining an encapsulated region between the encapsulation member and the substrate;
• a plate;
• a sidewall having first and second substantially parallel surfaces and disposed between the plate and the supporting surface of the encapsulation member to define an encapsulated region therebetween;
• and
• a sealing agent disposed in interfaces between the plate and the sidewall and between the sidewall and the encapsulation member to effect a vacuum seal at the interfaces such that when the encapsulated regions are evacuated the encapsulated regions will be at substantially the same vacuum levels to substantially eliminate differential pressure induced deformation of the substrate.

An evacuated substrate enclosure comprising:

• a substrate, having first and second major surfaces, and defining an aperture therebetween;
• a first encapsulation member having a generally circumferentially extending mating surface;
• a second encapsulation member having a generally circumferentially extending mating surface proximally disposed with respect to the mating surface of the first encapsulation member so as to define an encapsulated region between the first and second encapsulation members, the second encapsulation member defining an aperture therethrough and having a ledge formed therein so as to be directed inwardly into the encapsulated region with the substrate being supported thereon;
• and
• a sealing agent disposed between the mating surface of the first encapsulation member and the mating surface of the second encapsulation member to effect a vacuum seal such that when the encapsulated regions are evacuated the encapsulated regions will be at substantially the same vacuum levels to substantially eliminate differential pressure induced deformation of the substrate.

An evacuated substrate enclosure comprising:

• a substrate;
• a first encapsulation member defining a cavity with a generally circumferentially mating surface extending therearound;
• a second encapsulation member defining a cavity with a generally circumferentially mating surface extending therearound and proximally disposed with respect to the mating surface of the first encapsulation member so as to define an encapsulated region between the first and second encapsulation members,
• means, within one of the first and second encapsulation members, receiving the substrate for fixedly supporting the substrate and defining a communicating passage between the cavities of the first and second encapsulation members within the encapsulated region;
• and
• a sealing agent disposed between the mating surfaces of the first and second encapsulation members to effect a vacuum seal such that when the encapsulated region is evacuated it will be at substantially the same vacuum levels throughout to substantially eliminate differential pressure induced deformation of the substrate.