Method and apparatus for fine working or microfinishing
AssigneeSupfina Maschinenfabrik Hentzen KG
InventorHeinz G. Schmitz
Life of this patent
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Abstract
The invention relates to a method and an apparatus for fine-working or microfinishing of workpiece surfaces, particularly rotationally-symmetrically moved workpieces (38) with oscillating or rotating tools such as honing stones (18) or fine polishing stones, which are infed against the workpiece (38). Dependent on a measured parameter proportional to the machining force, the tool infeed is controlled such that a continuous workpiece material remove with constant removal speed is achieved. The reaction force is measured at any point in the flux of force to determine the machining force.
Claims10
Method for microfinishing workpiece surfaces of rotationally moving symmetrical workpieces, with a short-stroke oscillating tool having a surface of geometrically uneven cutting edges which can be fed against the workpiece,
- during the material removal phase, so that spaces remain between the uneven cutting edges of the tool not in contact with the workpiece which spaces form a gap variable in size, the method comprising;
- moving the oscillating tool relative to the workpiece so that at least some of the geometrically uneven cutting edges cause pressure against the workpiece and generating a reaction force, the non-contacting cutting edges defining the gap size,
- controlling the size of said gap in response to a parameter which is a measure of the reaction force, said reaction force being opposed to the pressure of the tool.
Dependencies are inferred from the claim text.