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AssigneeNorth Carolina State University at Raleigh
InventorsMehmet C. Ozturk, Douglas T. Grider, Mahesh K. Sanganeria, Stanton P. Ashburn
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Doped silicon-germanium alloy is selectively deposited on a semiconductor substrate, and the semiconductor substrate is then heated to diffuse at least some of the dopant from the silicon-germanium alloy into the semiconductor substrate to form a doped region at the face of the semiconductor substrate. The doped silicon-germanium alloy acts as a diffusion source for the dopant, so that shallow doped, regions may be formed at the face of the semiconductor substrate without ion implantation. A high performance contact to the doped region is also provided by forming a metal layer on the doped silicon-germanium alloy layer and heating to react at least part of the silicon-germanium alloy layer with at least part of the metal layer to form a layer of germanosilicide alloy over the doped regions. The method of the present invention is particularly suitable for forming shallow source and drain regions for a field effect transistor, and self-aligned source and drain contacts therefor.
A method of forming a doped region for a semiconductor device comprising the steps of:
A method of forming a semiconductor device comprising the steps of:
A method of forming a field effect transistor comprising the steps of:
Dependencies are inferred from the claim text.