Method for forming filled holes in multi-layer integrated circuit packages

Abstract

In an apparatus for forming filled via holes in ceramic substrates or wafers, upper and lower masks or dies each having at least one hole are clamped between opposing injection and base members with a wafer placed between the masks. The injection member has an injection chamber containing conductive ink material which is connected with the or each hole in the upper mask. An injection device such as a piston is used to force ink out of the chamber through the or each hole in the adjacent mask, punching one or more plugs of wafer material out of the wafer and replacing each punched-out plug with ink material, the plugs being pushed into the or each aligned hole in the other mask, which acts as a stripper. In one version, each die has a single hole and filled holes are formed sequentially at successive points on the wafer. In an alternative, each die or mask has a plurality of holes and the filled holes are formed simultaneously.

Dependencies are inferred from the claim text.