Built-in test circuit connection for wafer level burnin and testing of individual dies

Test circuitry for testing a device under test (DUT) which is formed as one of a plurality of semiconductor dies on a semiconductor wafer, in which the response of the DUT at different operating speeds is to be determined, the test circuit comprising:

• a) an oscillator circuit providing a periodic output;
• b) circuitry for varying the period of the periodic output;
• c) circuitry receiving the periodic output and providing a timing signal to the DUT, the timing signal having a period which is proportional to the periodic output;
• d) scanning circuitry for determining outputs of the DUT when the DUT is receiving the timing signal;
• e) a conductive grid deposited upon the wafer and formed by applying a supplemental conductive metal mask on the wafer, the conductive grid being connected to power and ground connections on the semiconductor die and further being connected to the test enable nodes on the semiconductor die, whereby power connections to the grid are capable of supplying power to the semiconductor die and to the test circuitry, and said grid being connected to the test enable nodes to provide signals to the test enable nodes;
• and
• f) the grid being deposited on the wafer in such a manner that a grid may be removed subsequent to testing, thereby permitting the integrated circuit devices to be operated without enabling the test circuitry.

A semiconductor wafer having a plurality of integrated circuit devices thereon, in which the integrated circuit devices contain built in test circuitry, the wafer comprising:

• a) said integrated circuit devices containing built in test circuitry thereon, said built in test circuitry including circuitry to accomplish a more thorough test regimen, the circuitry to accomplish a more thorough test regimen including a circuit which has at least two modes of operation, including a "slow" mode, in order to provide a variable speed output, the "slow" mode being engaged by said metal mask layer being on the wafer;
• b) the integrated circuit devices having test enable nodes thereon, said test enable nodes enabling said built in test circuitry;
• c) a conductive grid deposited upon the wafer and formed by applying a supplemental conductive metal mask on the wafer, the conductive grid being connected to power and ground connections on the semiconductor die and further being connected to the test enable nodes on the semiconductor die, whereby power connections to the grid are capable of supplying power to the semiconductor die and to the test circuitry, and said grid being connected to the test enable nodes to provide signals to the test enable nodes;
• and
• d) the gird being deposited on the wafer in such a manner that connections through the grid may be removed subsequent to testing, thereby permitting the integrated circuit devices to be operated without enabling the test circuitry.

A semiconductor wafer having a plurality of integrated circuit devices thereon, in which the integrated circuit devices contain built in test circuitry, the wafer comprising:

• a) said integrated circuit devices containing built in test circuitry thereon;
• b) the integrated circuit devices having test enable nodes thereon, said test enable nodes enabling said built in test circuitry;
• c) a conductive grid deposited upon the wafer and formed by applying a supplemental conductive metal mask on the wafer, the conductive grid being connected to power and ground connections on the semiconductor die and further being connected to the test enable nodes on the semiconductor die, whereby power connections to the grid are capable of supplying power to the semiconductor die and to the test circuitry, and said grid being connected to the test enable nodes to provide signals to the test enable nodes;
• and
• d) the grid being deposited on the wafer in such a manner that connections through the grid may be removed subsequent to testing, thereby permitting the integrated circuit devices to be operated without enabling the test circuitry, said removal of the grid being accomplished by said removal of the metal mask layer from the wafer by the use of a mechanical planarization process.

A semiconductor wafer having a plurality of integrated circuit devices thereon, in which the integrated circuit devices contain built in test circuitry, the wafer comprising:

• a) said integrated circuit devices containing built in test circuitry thereon;
• b) the integrated circuit devices having test enable nodes thereon, said test enable nodes enabling said built in test circuitry;
• c) a conductive grid deposited upon the wafer and formed by applying a supplemental conductive metal mask on the wafer, the conductive grid being connected to power and ground connections on the semiconductor die and further being connected to the test enable nodes on the semiconductor die, whereby power connections to the grid are capable of supplying power to the semiconductor die and to the test circuitry, and said grid being connected to the test enable nodes to provide signals to the test enable nodes;
• d) the grid being deposited on the wafer in such a manner that connections through the grid may be removed subsequent to testing, thereby permitting the integrated circuit devices to be operated without enabling the test circuitry;
• e) the plurality of conductive traces on the wafer including a power supply grid and a common grid;
• and
• f) one of said power supply and common grids further providing a test enable signal to each DUT.