Terminals of surface mount components
OwnerClarence S. Yooinventor
Life of this patent
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Abstract
The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.
Claims1
A terminal comprising a modification of a straight terminal, said straight terminal being a member having a length axis, an outside surface and a bonding surface, said outside surface being suitable for making a solder bond between a lead and a bond site, said modification enhancing the adhesion of said solder bond, said modifications also providing a solder relief terminal including a solder relief hole having a bonding opening in said bonding surface, an escape opening in said outside surface spaced apart from said bonding opening, and hole sides extending between said bonding opening and the escape opening.
Dependencies are inferred from the claim text.