Apparatus for cooling integrated circuit chips

An apparatus for cooling a plurality of integrated circuit chips comprising:

• a cooling plate having a plurality of integral, substantially parallel, closed-end, closed-bottom channels extending along an axis, on and open to, a surface of the cooling member;
• and
• a cover adapted to seal the periphery of said cooling plate and spaced from the channel-containing surface, said cover having a plurality of integral baffles projecting toward the cooling plate and extending into and along the length of said channels below the channel-containing surface of said cooling member, said baffles and said channels being spaced from each other to permit passage of a coolant between and through said channels in a flow direction normal to said channels, said baffles being adapted to direct said coolant in an impinging flow against the bottom of said channels.

An apparatus for cooling a plurality of integrated circuit chips mounted on a substrate comprising:

• a cooling plate made of a thermally conductive material, said plate having a plurality of integral, substantially parallel, closed-end, closed-bottom channels extending along an axis on, and open to, a surface of the cooling member;
• and
• a cover adapted to seal the periphery of said cooling plate and spaced from the channel-containing surface, said cover having a plurality of integral baffles projecting toward the cooling plate and extending into and along the complete length of said channels below the channel-containing surface of said cooling member, said baffles and said channels being spaced from each other to permit passage of a coolant between and through said channels in a flow direction normal to the axis of said channels, said baffles being adapted to direct said coolant in an impinging flow against the bottom of said channels.