Method of dividing semiconductor wafer using ultraviolet sensitive tape

A method of producing semiconductor devices by dividing a semiconductor wafer into a plurality of dice comprising:

• adhering a generally annular frame to an ultraviolet sensitive tape, the adhesiveness of said ultraviolet sensitive tape weakening when said ultraviolet sensitive tape is irradiated with ultraviolet light;
• placing a semiconductor wafer within said annular frame and adhering said semiconductor wafer to the ultraviolet sensitive tape adhered to said frame;
• depressing said annular frame relative to said semiconductor wafer, thereby stretching said ultraviolet sensitive tape and elevating said semiconductor wafer relative to said annular frame;
• scribing said semiconductor wafer adhered to said ultraviolet sensitive tape along cut lines on the side of said semiconductor wafer opposite said ultraviolet sensitive tape while said semiconductor wafer is elevated relative to said frame, thereby dividing said semiconductor wafer into a plurality of dice;
• releasing said frame and said ultraviolet tape, thereby lowering said semiconductor wafer relative to said frame;
• breaking said semiconductor wafer into a plurality of dice along said cut lines by plunging a breaking jig against the side of said semiconductor wafer adhered to said ultraviolet sensitive tape and opposite to the scribed side of said semiconductor wafer;
• and
• irradiating said ultraviolet sensitive tape with ultraviolet light to reduce the adhesiveness of said ultraviolet sensitive tape.